WebHMC5883L 并不推荐手工焊接，如必须使用，需注意下述两方面： 1）锡膏最高温度不能超过 315℃，IC 不能加热时间过长; 2）如果 IC 未保持在持续的干燥环境下，那么在封装之前必须进行烘烤，因 为 IC 对湿度比较灵敏（MSL3） 建议使用最高温度为 260℃的 Reflow 流程 ... WebFigure 1: Typical Conditions for Pb-Free Reflow Soldering Table 2: Peak Package Reflow Body Temperature for Xilinx Pb-Free Packages (Based on J-STD-020 Standard)(1) …

Baking Time and Moisture Sensitivity Label Information

WebMost semiconductor products are rated MSL3 or higher. MSL 1 is the highest rating where it is considered ... For the customer production reflow soldering process, the peak reflow temperature (Tp) has to be lower than the classification reflow temperature (Tp) shown in Table 2 and Figure 3. The reflow profile and peak Moisture sensitivity level (MSL) is a rating that shows a device's susceptibility to damage due to absorbed moisture when subjected to reflow soldering as defined in J-STD-020. It relates to the packaging and handling precautions for some semiconductors. The MSL is an electronic standard for the time period in which a moisture sensitive device can be exposed to ambient room conditions (30 °C/85%RH at Level 1; 30 °C/60%RH at all other levels). barbell\\u0027s da

Power Module MSL Ratings and Reflow Profiles

WebSOLD Reflow soldering temperature c 260 °C Notes: a. In off-state, spike duty cycle D<0.01, spike duration <30 s. b. For increased stability at high current operation, see Circuit Implementation on page 3 c. Reflow MSL3 Thermal Resistance Symbol Parameter Typical Unit RΘJC Junction-to-case 5.5 °C/W RΘJA Junction-to-ambient d 50 °C/W Notes: d. WebPower Module MSL Ratings and Reflow Profiles 3 Reflow Profile for Lead-Free Soldering When reflowing TI power modules, the peak reflow rating of the device must be observed … WebThe MSL reclassification is performed on the largest die size that is used in the package. The tests to be performed typically include: Preconditioned Highly Accelerated Stress … supletivo online grátis 2022